JPH0249546B2 - - Google Patents

Info

Publication number
JPH0249546B2
JPH0249546B2 JP60064874A JP6487485A JPH0249546B2 JP H0249546 B2 JPH0249546 B2 JP H0249546B2 JP 60064874 A JP60064874 A JP 60064874A JP 6487485 A JP6487485 A JP 6487485A JP H0249546 B2 JPH0249546 B2 JP H0249546B2
Authority
JP
Japan
Prior art keywords
plating
base material
pattern
circuit
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60064874A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61224393A (ja
Inventor
Tsuneo Sen
Taro Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Soda Co Ltd
Original Assignee
Daiso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daiso Co Ltd filed Critical Daiso Co Ltd
Priority to JP6487485A priority Critical patent/JPS61224393A/ja
Publication of JPS61224393A publication Critical patent/JPS61224393A/ja
Publication of JPH0249546B2 publication Critical patent/JPH0249546B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP6487485A 1985-03-28 1985-03-28 メッキ回路基板の製法 Granted JPS61224393A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6487485A JPS61224393A (ja) 1985-03-28 1985-03-28 メッキ回路基板の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6487485A JPS61224393A (ja) 1985-03-28 1985-03-28 メッキ回路基板の製法

Publications (2)

Publication Number Publication Date
JPS61224393A JPS61224393A (ja) 1986-10-06
JPH0249546B2 true JPH0249546B2 (en]) 1990-10-30

Family

ID=13270711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6487485A Granted JPS61224393A (ja) 1985-03-28 1985-03-28 メッキ回路基板の製法

Country Status (1)

Country Link
JP (1) JPS61224393A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9883583B2 (en) * 2015-09-02 2018-01-30 Apple Inc. Fabric signal path structures for flexible devices

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61107792A (ja) * 1984-10-31 1986-05-26 東芝シリコ−ン株式会社 回路基布の形成方法

Also Published As

Publication number Publication date
JPS61224393A (ja) 1986-10-06

Similar Documents

Publication Publication Date Title
JP3728068B2 (ja) 多層配線基板
JPH0249546B2 (en])
JPS61107792A (ja) 回路基布の形成方法
JP3600295B2 (ja) 印刷配線板の製造方法
JPH049396B2 (en])
JPH08125331A (ja) 印刷配線板の製造方法
JP3474913B2 (ja) プリント配線板の製造方法
JPH08204334A (ja) 印刷配線板の製造方法
JPS62277794A (ja) 内層回路板の製造方法
JPS58210691A (ja) 金属箔張積層板の製法
JP3600294B2 (ja) 印刷配線板の製造方法
JPH05243742A (ja) 多層プリント配線板及びその製造方法
JPH01150388A (ja) 多層配線板
JPH01150387A (ja) プリント配線板
JPH0336315B2 (en])
JPS63272097A (ja) 多層回路基板の製造法
JPS6174390A (ja) 平滑配線板の製法
JP2004066763A (ja) 金属箔積層板及びその製造方法
JP2002200616A (ja) 配線基板プリプレグの製造方法
JPS6236895A (ja) フレキシブル回路基板の製造方法
JPH0416037B2 (en])
JPH05251850A (ja) 射出成形プリント配線体用転写シート
JPS61110488A (ja) 回路基布を形成する方法
JPH0441443B2 (en])
JPH08172269A (ja) 印刷配線板の製造方法